Double Side PCB FR4 TG170 0.2mm immersion gold black solder mask circuit board
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
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Product Description |
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Model Number: |
CTE0210002 |
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Number of Layer: |
2layer |
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Material: |
FR4 |
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Finish Thickness: |
0.2mm |
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Finish copper: |
1OZ |
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Surface Finish: |
Immersion gold |
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Black solder mask |
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White silkscreen |
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CNC routing |
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Place of Origin: |
China |
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Brand Name: |
CHITUN |
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Certification: |
UL,ROHS,ISO |
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Standard: |
IPC or base on customers' requestion |
ChiTun Leading the Printed Circuit Board Industry
With over 15years of experience, Chi Tun Electronics LTD is rapidly becoming the logical choice for PCB manufacturers in China. We're proud to manufacture high-quality products. We can handle production orders on 1 layers all the up to 24 layers. and we have quick turn , Small volume and large volume service type without MOQ.
Applications(Target Market):
Cooling and Washing machine, Switching Power Amplifiers, Home Computer, Home Theater/Stereo Surround Sound System, Cable Television Converter Box, Hand Held Video Games, Digital and analog Switching, Remote control electronic toys, Disk Drive duplication systems, LOJACK auto recovery system, Electronic Television Audience Measurement Systems/Electronic Audience Measurement Systems,Headphone Systems ect.
Technology Capability
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Feature |
2015 |
2016 |
2017 |
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Base Material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
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Max. Layer Count |
24 |
30 |
32 |
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Max. PCB Size (max.) |
558mm X 660mm |
558mm X 660mm |
558mm X 660mm |
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Base copper |
1/3 oz - - 5 oz |
1/3 - - 5 oz |
1/3 - - 5 oz |
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Copper thickness (outer) |
6 oz |
6 oz |
6 oz |
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Max. Board Thickness mm (mil) |
3.4 (134) |
3.4 (134) |
3.4 (134) |
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Min. Board Thickness mm (mil) |
0.1 (4) |
0.1 (4) |
0.1 (4) |
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Min. Line Width / Spacing |
Inner um (mil) |
75/100 (3 4) |
75/75 (3/3) |
75/75 (3/3) |
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Outer um (mil) |
100/100 (4/4) |
75/75 (3/3) |
75/75 (3/3) |
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Min. Mechanical Drill Size (mm) |
0.2 |
0.2 |
0.2 |
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Min. HWTC um (mil) |
175 (7) |
175 (7) |
175 (7) |
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Min. Soldermask Opening um (mil) |
50 (2) |
50 (2) |
50 (2) |
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Finest SMT Pitch mm (mil) |
0.40 (16) |
0.45 (18) |
0.45 (18) |
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BGA Device Pitch (Base Copper 1oz) (mil) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
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Type of Surface Finish |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
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Company InfoChi Tun Electronics Co.,Ltd [China (Mainland)]
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