Specifications | Technology | Notes |
Number of Layers | 1-24 Layers | |
Board Materials | FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials | We keep these materials in stock.
If you need a material
that is not listed here,
please contact us and
we can order it for you. |
Stiffeners | Thermo Set and PSA Based Aluminum
FR4
Stainless Steel
Polymide | |
Final PCB Thickness | 2 Layer – Min .005” Max .250”
4 Layer – Min .015” Max .250”
6 Layer – Min .025” Max .250”
8 Layer – Min .031” Max .250”
10 Layer – Min .040” Max .250”
12 Layer – Min .047” Max .250”
14 Layer – Min .054” Max .250”
16 Layer – Min .062” Max .250”
18 Layer – Min .093” Max .250”
20 Layer – Min .125” Max .250”
22 Layer – Min .125” Max .250”
>24 Layer – Min .125” Max .250” | |
Core Thickness | Min .0025” | |
Maximum PCB Size | 2 Layer 20” x 28”
Mulitlayer 16” x 26” | |
Minimum Conductor
Space | 0.003” | |
Minimum Conductor
Width | 0.003” | |
Minimum Drill Hole
Size | 0.006” | |
Finish Plating /
Surface Finishes | HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG | |
Finished Copper –
Outer Layers | 1oz Cu – Min .004” Trace/Space
2oz Cu – Min .005” Trace Space
3oz Cu – Min .008” Trace/Space
4oz Cu – Min .010” Trace/Space
5oz Cu – Min .012” Trace/Space | We can manufacture
higher ounces of
copper depending on the specs.
Please let us know
how much you would like
when sending us your PCB specs. |
Finished Copper –
Inner Layers | .5oz Cu – Min .004” Trace/Space
1oz Cu – Min .005” Trace/Space
2oz Cu – Min .006” Trace/Space
3oz Cu – Min .010” Trace/Space
4oz Cu – Min .012” Trace/Space | |
Inner Layer Clearances | Min .008”
Minimum Finished Hole Size
Final Thickness <=.062” – .006’
Hole Final Thickness .150” – .014” Hole
Final Thickness .093” – .010”
Hole Final Thickness .200” – .018” Hole
Final Thickness .125” – .012”
Hole Final Thickness .250” – .020” Hole | |
Gold Fingers | 1 to 4 edges | |
Solder Mask Type | Per IPC-SM-840
LPI Soldermask
Peelable Soldermask | |
Solder Mask Colors | Green/Green
Matte White
Black/Black
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix | |
Silkscreen Type | Thermal Cure Epoxy Ink
LPI Ink | |
Silkscreen Colors | White
Black
Yellow Top and Bottom Mix
Red One or Both Sides Mix
Blue | |
CNC Functions | Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250” Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks | |
Other PCB Services | Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias | |
Quality / Testing | Inspect to IPC Class III Continuity Resistance
– 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance
– 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum
SMT Pitch 0.5 mm | |
Tolerances | PTH Hole Size – +/- .002”
Front to Back – +/- .002”
NPTH Hole Size – +/- .001”
Solder Mask – +/- .002”
Tooling Holes – +/- .001”
Hole to Pad – +/- .005” | |
